OPTIMATION ZP-MC06B-1-MS0 06 Vacuum Suction Cup Assembly

Module Feature

ZP-MC06B-1-MS0 06 is industrial bellows type vacuum suction cup assembly. It is specially designed for wafer and thin substrate handling in semiconductor wet bench equipment. The bellows structure provides small stroke and compliance to compensate minor workpiece height difference during pick and place. Model suffix 06 represents 6mm suction cup diameter. MS0 is thread specification, B stands for bellows style. The suction cup material has good chemical resistance to common wet process chemicals. Widely applied in chemical delivery and wet bench wafer transfer station.

Working principle: Vacuum negative pressure is applied inside the bellow cup, the cup deforms and adheres tightly on wafer surface to hold workpiece. When vacuum is released, the cup releases the substrate. The bellows design absorbs small parallelism error and contact impact during picking action. Onboard components:Bellows suction cup, metal threaded fitting, vacuum passage connector

LED indicatorsNo LED indicators, passive pneumatic component

Hardware self-diagnosis

Visual inspection for cup crack and aging, vacuum leak test, thread fitting tightness check

Programming softwareNo configuration software required, pneumatic mechanical accessory

Electrical & Process ParametersNo electrical requirement, driven by vacuum generator

Mechanical & Structure

Cup diameter:6mm Cup type:Bellows Mount thread:MS0 Material:Chemical resistant rubber Mounting:Direct thread installation on vacuum gripper Protection class:IP65

Environmental

Operating temperature:0℃ ~ +60℃ Ambient humidity:5~95% non-condensing Chemical resistance:Resist common wet bench solvents and dilute acid/alkali Status:Industrial vacuum suction cup assembly

System compatibility

Compatible with vacuum generator, pneumatic solenoid valve and wafer handling robot end effector in wet bench system.

Function

ZP-MC06B-1-MS0 06 suction cup is used for picking and releasing thin wafer substrates. Cup aging, crack or surface scratch will cause vacuum leakage and workpiece drop. It is pneumatic end effector accessory for semiconductor wet bench wafer handling automation.

Installation

Follow lockout/tagout safety procedure before installation. Shut down vacuum supply. Screw the assembly onto gripper vacuum port, tighten fitting. Connect vacuum pipeline, perform vacuum leakage test before wafer handling operation.

InterfaceThread mounting interface and internal vacuum air passage.

Diagnostic

Vacuum leakage:Suction cup cracked, worn or loose thread connection. Cannot pick workpiece:Vacuum pressure insufficient or cup surface contaminated. Cup deformation:Long time chemical corrosion.

Product Brief

ZP-MC06B-1-MS0 06 bellows vacuum suction cup assembly,6mm diameter,chemical resistant rubber,for semiconductor wet bench wafer pick and place handling.